Heating gas supplier for semiconductor manufacturing equipment



This article is transparent. This article is used in semiconductormanufacturing equipment. A heating gas is supplied to the rear face of asemiconductor wafer in order to drive heat exchange between a lowerelectrode and the rear face of the semiconductor wafer. This article isinstalled in a tube for supplying the heating gas. In the front viewdrawing, the spiral forms three two-cavity ducts. The spiral ducts actas gas passages in order to prevent an abnormal discharge. The outerdiameter of this article is between about 25 mm and 10 mm and the heightis between about 60 mm and 70 mm. This article is made of quartz. Otherembodiments (not shown) are translucent or opaque in whole or partand/or may be made of other materials.

FIG. 1 is a top/front perspective view of a first embodiment of aheating gas supplier for semiconductor manufacturing equipment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a sectional view taken along the line 8—8 in FIG. 6;

FIG. 9 is a top/front perspective view of a second embodiment of theheating gas supplier for semiconductor manufacturing equipment;

FIG. 10 is a front elevational view thereof, the rear elevational viewbeing a mirror image thereof and, therefore, not shown;

FIG. 11 is a right side elevational view thereof, the left sideelevational view being a mirror image thereof and, therefore, not shown;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a sectional view taken along the line 14—14 in FIG. 12.

I claim the ornamental design for heating gas supplier for semiconductormanufacturing equipment, as shown and described.